First introduced about a decade ago, the first edition of the Handbook of
Semiconductor Interconnection Technology became widely popular for its thorough,
integrated treatment of interconnect technologies and its forward-looking
perspective. The field has grown tremendously in the interim and many of the
"likely directions" outlined in the first edition are now standard in modern
facilities. Reflecting those advances, this edition delves into the practical
aspects of interconnections for manufacturing. It examines the interconnect and
fabrication technologies now available, with an examination of future prospects
for the field.
What's in this Edition:
Detailed discussion of electrochemical equipment for plating copper
Information on tools used for evaporation, chemical vapor