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Characterization Of Integrated Circuit Packaging Materials (Materials Characterization)
by Thomas Moore (Author),
Momentum Press (Publisher)
Product Specifications
Book Description
With a particular emphasis on fabrication quality control, this volume in the
Materials Characterization series focuses on characterization techniques used
for critical junctures in package design like mold compound adhesion and
strength, mechanical stres
Book Specifications
ISBN-13 9781606501870
Language English
Binding Hard Bound
Publisher Momentum Press
Publishing Date 2010-03-15
Product Edition 1st Edition