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Book Summary
With a particular emphasis on fabrication quality control, this volume in the
Materials Characterization series focuses on characterization techniques used
for critical junctures in package design like mold compound adhesion and
strength, mechanical stres
- ISBN-13
- 9781606501870
- Language
- English
- Binding
- Hard Bound
- Publisher
- Momentum Press
- Publishing Date
- 2010-03-15
- Product Edition
- 1st Edition
Characterization Of Integrated Circuit Packaging Materials (Materials Characterization)
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Product Specifications
Book Summary
With a particular emphasis on fabrication quality control, this volume in the
Materials Characterization series focuses on characterization techniques used
for critical junctures in package design like mold compound adhesion and
strength, mechanical stres
Book Specifications
- ISBN-13
- 9781606501870
- Language
- English
- Binding
- Hard Bound
- Publisher
- Momentum Press
- Publishing Date
- 2010-03-15
- Product Edition
- 1st Edition