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Book Summary
About the Book: Advances in 3d Integrated Circuits and Systems
3D integration is an emerging technology for the design of many-core
microprocessors and memory integration. This book, Advances in 3D Integrated
Circuits and Systems, is written to help readers understand 3D integrated
circuits in three stages: device basics, system level management, and real
designs.Contents presented in this book include fabrication techniques for 3D
TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O
management; and 3D designs of sensors, I/Os, multi-core processors, and
memory.Advanced undergraduates, graduate students, researchers and engineers may
find this text useful for understanding the many challenges faced in the
development and building
- ISBN-13
- 9798886131307
- Language
- English
- Binding
- Paper Back
- Publisher
- World Scientific India
- Publishing Date
- 2025
- Total Pages
- 392
Advances in 3d Integrated Circuits and Systems
by Hao Yu, Chuan Seng Tan (Author),
World Scientific India (Publisher)
fictionfantasyyoung adultaward winning
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Product Specifications
Book Summary
About the Book: Advances in 3d Integrated Circuits and Systems
3D integration is an emerging technology for the design of many-core
microprocessors and memory integration. This book, Advances in 3D Integrated
Circuits and Systems, is written to help readers understand 3D integrated
circuits in three stages: device basics, system level management, and real
designs.Contents presented in this book include fabrication techniques for 3D
TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O
management; and 3D designs of sensors, I/Os, multi-core processors, and
memory.Advanced undergraduates, graduate students, researchers and engineers may
find this text useful for understanding the many challenges faced in the
development and building
Book Specifications
- ISBN-13
- 9798886131307
- Language
- English
- Binding
- Paper Back
- Publisher
- World Scientific India
- Publishing Date
- 2025
- Total Pages
- 392